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New Materials. Smaller Parts. Tougher PCBA Cleaning.
February 10, 2026
Electronics cleaning is getting tougher.

As PCBAs become smaller, denser, and more complex, the margin for error in cleaning processes continues to shrink. Miniaturized assemblies with low standoff heights and tightly packed components make it harder to remove flux residues, oils, and particulates. At the same time, advanced substrates and mixed-material designs introduce new risks related to chemical compatibility and long-term reliability.

What was once a straightforward cleaning step has become a yield- and reliability-critical process.

Advanced Materials Change the Cleaning Equation
Modern electronics designs often combine multiple materials within a single assembly, including:
  • Aluminum and stainless steel housings
  • Brass connectors and contacts
  • High-performance polymers such as Delrin, PEEK, Ultem, and PTFE
  • Laminates like G10/FR4
Each of these materials responds differently to cleaning chemistries. A fluid that effectively removes contamination from one substrate may interact negatively with another, leading to surface attack, swelling, stress cracking, or residue entrapment. In mixed-material PCBAs, compatibility must be considered across the entire assembly, not just the solder joints.

As designs evolve, cleaning chemistry must evolve with them.

Why Harsher Chemistry Isn’t the Answer
When cleaning performance drops, it can be tempting to look for stronger or more aggressive chemistries. However, harsher chemistry often introduces new problems rather than solving the original ones.

Aggressive fluids may increase the risk of material degradation, discoloration, or long-term reliability failures, especially with sensitive polymers and plastics. In addition, stronger chemistries can be more difficult to control, harder to rinse or dry, and less forgiving in precision cleaning processes.

The real solution isn’t harsher chemistry.
It’s fluid compatibility.

Effective Cleaning Starts with the Right Match
Successful PCBA cleaning depends on aligning three critical factors:
  1. The contamination – flux residues, oils, particulates, or handling soils
  2. The substrate – metals, polymers, laminates, and coatings
  3. The process conditions – equipment type, dwell time, temperature, and drying requirements
MicroCare PCBA cleaning products are designed to support this precision approach. From flux removers and precision cleaners to vapor degreasing fluids, MicroCare solutions are formulated to deliver effective cleaning while maintaining compatibility with sensitive materials and complex assemblies.

Matching the right cleaning fluid to both the contamination and the substrate helps ensure effective removal without damaging materials or compromising reliability. This approach supports higher yield, improved consistency, and reduced rework.

Expertise Beyond the Cleaning Fluid
Optimizing PCBA cleaning performance often requires more than selecting a product. Manufacturers benefit from technical expertise that considers real-world process variables, material interactions, and performance requirements.

MicroCare combines in-the-field electronics cleaning support with MicroCare Critical Cleaning Lab evaluation to help manufacturers validate material compatibility, troubleshoot cleaning challenges, and refine processes before issues appear in production. This collaborative approach helps ensure that cleaning solutions perform as intended—not just in theory, but on the production floor.

Cleaning for Today’s Electronics—and Tomorrow’s
As electronics continue to shrink and materials continue to advance, PCBA cleaning will only grow more demanding. Manufacturers that focus on precision compatibility rather than aggressive chemistry will be better positioned to protect yield, maintain reliability, and meet evolving performance standards.

In today’s electronics environment, cleaning success is no longer just about removing contamination. It’s about cleaning smarter.
 

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